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PCN/EOL Systems:
Explains Micron's product change notification and end-of-life systems.
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CSN-12
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04/2012
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79.21 KB
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Customer Service Note
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Wafer Packaging and Packaging Materials:
Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
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CSN-20
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09/2011
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776.24 KB
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Customer Service Note
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Bare Die SiPs and MCMs:
Describes design considerations for bare die SiPs and MCMs.
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CSN-18
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04/2009
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151.06 KB
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Customer Service Note
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Shipping Quantities:
Provides tables of part quantity.
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CSN-04
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04/2012
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472.27 KB
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Customer Service Note
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Micron KGD Definitions:
Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die.
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CSN-22
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07/2009
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65.52 KB
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Customer Service Note
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Proper Handling Procedures for Modules:
Includes procedures for how to properly handle modules.
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CSN-23
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12/2007
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1.02 MB
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Customer Service Note
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Micron Component and Module Packaging:
Explanation of Micron packaging labels and procedures.
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CSN-16
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02/2012
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887.13 KB
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Customer Service Note
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ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
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CSN-24
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08/2010
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119.08 KB
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Customer Service Note
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Electronic Data Interchange:
Describes EDI transmission sets, protocol, and contacts.
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CSN-06
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09/2005
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53.5 KB
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Customer Service Note
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RMA Procedures for Packaged Product and Bare Die Devices:
Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
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CSN-07
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10/2010
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82.64 KB
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Customer Service Note
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ISO System Management Standards:
Describes ISO system management standards.
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CSN-08
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04/2004
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39.18 KB
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Customer Service Note
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300mm Back Side Wafer ID:
This document describes the back side scribe used on 300mm wafers and Micron's procedure for reading and storing that identification.
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CSN-27
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11/2008
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65.49 KB
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Customer Service Note
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PoP User Guide:
Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.
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CSN-34
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08/2011
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846.18 KB
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Customer Service Note
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Lead Frame Package User Guidelines:
Discusses Micron's lead-frame package options
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CSN-30
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05/2011
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245.66 KB
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Customer Service Note
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Proper Handling Procedures for WQVGA Display Panels:
Micron WQVGA display panels must be handled according to specific procedures at all times. Maintaining proper conditions, and using proper precautions, handling techniques, and cleaning methods will help ensure prolonged, reliable operation of your WQVGA display panel products.
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CSN-32
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06/2011
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657.79 KB
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Customer Service Note
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Proper Handling Procedures for qHD Display Panels:
Micron qHD display panels must be handled according to specific procedures at all times. Maintaining proper conditions, and using proper precautions, handling techniques, and cleaning methods will help ensure prolonged, reliable operation of your qHD display panel products.
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CSN-31
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06/2011
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2.97 MB
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Customer Service Note
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Micron BGA Manufacturer's User Guide:
Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
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CSN-33
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07/2011
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353.32 KB
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Customer Service Note
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Microdisplay RMA Policy and Procedures:
Explains the RMA policy and procedures for Micron's Microdisplay products.
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CSN-29
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10/2011
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68.33 KB
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Customer Service Note
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Product Marks/Product and Packaging Labels:
Explains product part marking, and product and packaging labels.
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CSN-11
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04/2012
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724.89 KB
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Customer Service Note
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Proper Handling Procedures for Micron E330 Projection Engines:
MicronE330 Projection Engines must be handled according to specific procedures at all times. Maintaining proper conditions, and using proper precautions, handling techniques, and cleaning methods will help ensure prolonged, reliable operation of your E330 projection engines.
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CSN-35
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03/2012
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456.26 KB
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Customer Service Note
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Proper Handling Procedures for Micron SVGA+ Display Panels:
Micron SVGA+ display panels must be handled according to specific procedures at all times. Maintaining proper conditions, and using proper precautions, handling techniques, and cleaning methods will help ensure prolonged, reliable operation of your SVGA+ display panels.
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CSN-36
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05/2012
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360 KB
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Customer Service Note
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