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The
TECH Wafer Fabrication Specialist Manpower Programme (SMP) is jointly
funded by TECH Semiconductor and the Economic Development Board of
Singapore (EBD) in a bid to raise the profile of wafer fabrication and
promote development in this growing industry. All sponsored students under
this programme can expect Industrial Attachment opportunities and
guaranteed job offers upon graduation.
Under
the Wafer Fabrication SMP, EDB will work with the National University of
Singapore (NUS) and Nanyang Technological University (NTU) to reach out to
undergraduates in the schools of Chemical, Electrical, Electronics,
Materials and Mechanical Engineering to take up the specialisation in their
final year of study.
The
scholarship is worth up to S$13,000, with varying levels of stipend offered
to students, depending on the number of years dedicated to attaining their
specialisation:
- Students
specialising in wafer fabrication over one year will receive a monthly
stipend of S$1,080 during their final year.
- Students
specialising in wafer fabrication over two years will receive a
monthly stipend of S$540 during their final two years.
This programme
is open to all Singaporeans or Singapore Permanent Residents (SPR).
Non-Singaporeans/SPR
may also apply, provided that they attain SPR status one year after
graduation.
All
sponsored students under this programme are expected to serve a one-year
bond with TECH upon graduation.
Interested
applicants are invited to download and complete the following application
form, and to send it to staffmgr5@techsemicon.com.sg
by 31st March 2008.
TECH Semiconductor Singapore Pte. Ltd. All Rights
Reserved, Legal Disclaimer.
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