Parallel PCM Technical Notes

Type Secure Title & Description ID# Updated Size
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Moisture Absorption in Plastic Packages:  Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2010 87.26 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
Comparing P8P Parallel PCM and Parallel NOR Flash Memory:  Comparing the features of the 128Mb P8P parallel PCM and parallel NOR Flash memory devices enables users to migrate applications from NOR Flash to P8P parallel PCM. AN310053 11/2011 229.34 KB
Software Device Drivers for the Micron P8P Parallel PCM Device:  This technical note describes C library source code for the Micron P8P phase change memory (PCM) device using the P8P software device driver. TN-13-06 03/2011 238.6 KB
Extending PCM Temperature and Data Retention Ranges: Software Refresh Procedure:  This technical note describes a software procedure for refreshing data in Micron® P5Q serial phase change memory (PCM) and P8P parallel PCM devices to enable usage beyond current data sheet specifications. TN-13-07 06/2011 540.15 KB
Extending 90nm PCM Endurance from 1 Million WRITE Cycles Up to 1 Billion Cycles:  This technical note outlines a software solution called the parameter manager, which is used to increase the WRITE cycles for Micron's phase change memory (PCM) well beyond its standard endurance specifications. TN-13-09 11/2011 441.71 KB

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Parallel PCM