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IBIS Behavioral Models:
Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
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TN-00-07
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11/2009
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163.98 KB
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Technical Note
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Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
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TN-00-08
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05/2010
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252.18 KB
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Technical Note
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Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
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TN-00-15
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03/2007
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69.09 KB
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Technical Note
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Uprating of Semiconductors for High-Temperature Applications:
Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
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TN-00-18
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05/2010
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428.33 KB
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Technical Note
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Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
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TN-00-20
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12/2009
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1.52 MB
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Technical Note
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Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
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02/2010
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87.26 KB
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Technical Note
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Accelerate Design Cycles with Simulation Models:
Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
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TN-00-09
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02/2010
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206.91 KB
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Technical Note
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Micron Wire-Bonding Techniques:
This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
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TN-00-22
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11/2010
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66.13 KB
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Technical Note
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TN-10-21: Qualcomm QSC6695 Validation Report:
Rev. 1.0
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12/2011
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336.51 KB
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Technical Note
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TN-10-21: Qualcomm QSC6695 Register Settings:
Rev. 1.0
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12/2011
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482.14 KB
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Technical Note
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TN: PXA968 Register Settings:
This technical note outlines Mobile LPDDR and e-MMC operations with the PXA968 device, and
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03/2012
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267.27 KB
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Technical Note
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TN: PXA968 Validation Report Android 2.3:
This report highlights the validation testing Micron performed on the Marvell® PXA968 MG2 EVB board. The purpose of this testing was to validate Micron® 50nm and 43nm 200MHz Mobile Low-Power DDR SDRAM (Mobile LPDDR), and e-MMC v4.41 memory devices on the MG2 EVB platform.
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03/2012
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289.17 KB
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Technical Note
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Bypass Capacitor Selection for High-Speed Designs:
Describes bypass capacitor selection for high-speed designs.
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TN-00-06
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03/2011
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481.9 KB
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Technical Note
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