|
|
IBIS Behavioral Models:
Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
|
TN-00-07
|
11/2009
|
163.98 KB
|
Technical Note
|
|
|
|
Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
|
TN-00-08
|
05/2010
|
252.18 KB
|
Technical Note
|
|
|
|
Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
|
TN-00-15
|
03/2007
|
69.09 KB
|
Technical Note
|
|
|
|
Uprating of Semiconductors for High-Temperature Applications:
Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
|
TN-00-18
|
05/2010
|
428.33 KB
|
Technical Note
|
|
|
|
Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
|
TN-00-20
|
12/2009
|
1.52 MB
|
Technical Note
|
|
|
|
Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
|
TN-00-01
|
02/2010
|
87.26 KB
|
Technical Note
|
|
|
|
Accelerate Design Cycles with Simulation Models:
Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
|
TN-00-09
|
02/2010
|
206.91 KB
|
Technical Note
|
|
|
|
Micron Wire-Bonding Techniques:
This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
|
TN-00-22
|
11/2010
|
66.13 KB
|
Technical Note
|
|
|
|
TN-10-21: Qualcomm QSC6695 Validation Report:
Rev. 1.0
|
|
12/2011
|
336.51 KB
|
Technical Note
|
|
|
|
TN-10-21: Qualcomm QSC6695 Register Settings:
Rev. 1.0
|
|
12/2011
|
482.14 KB
|
Technical Note
|
|
|
|
Bypass Capacitor Selection for High-Speed Designs:
Describes bypass capacitor selection for high-speed designs.
|
TN-00-06
|
03/2011
|
481.9 KB
|
Technical Note
|
|
|
|
e·MMC Linux Enablement:
This technical note describes supported and unsupported e·MMC features and how to enable them in Linux. It includes a discussion of the e·MMC standard (4.41) introduced in March 2010.
|
TN-52-05
|
03/2012
|
299.97 KB
|
Technical Note
|