e-MMC

emmc

Targeting Mobile Multimedia Applications

Our e·MMC™ embedded memory combines a high-capacity NAND Flash memory device with a high-speed, MultiMediaCard (MMC) controller in a single package. Find out how you can get the performance and reliability you need and still get to market quickly using this cost-effective embedded memory.

NAND Flash for Mobile Multimedia

Superior Mass Storage
Our e·MMC embedded memory combines high-quality, low-cost NAND Flash memory with a high-speed, JEDEC-compliant MultiMediaCard (MMC) controller in a single, low-profile BGA package. The single-package solution is a great choice for designers who are looking for MMC-like, application-to-application interoperability. And because we manufacture the NAND, we can offer e·MMC solutions in a variety of densities and options; contact us for inquiries and more information.

e·MMC Documentation

Easy to Design In

Our e·MMC embedded memory essentially transforms a program/erase/read device like NAND Flash into a simple write/read memory. This managed interface addresses potential NAND design concerns internally, using error correction code (ECC), wear leveling, and bad block management technology. Handling errors internally takes the burden off the host controller and increases speed, providing higher system performance.

nand compar

Streamlined Development and Qualification
e·MMC embedded memory also simplifies hardware and software integration by providing a standard interface specification that minimizes the need for host software to accommodate process node migrations and vendor-specific NAND Flash characteristics. It’s a consistent, technology-independent solution that streamlines the development and qualification process and alleviates complexities of designing in current and future NAND devices.

Other Key Benefits

Smooth Transition to MLC
Provides a seamless transition from SLC NAND to MLC NAND.

Easy-to-Use BGA Package
Saves significant resources that would otherwise go to hardware and software development.

High-Performance Controller
Removes the burden of several low-level tasks from the processor.

Standard Interface Specification
Supported by major mobile customers and enablers and compliant with the MMC specification.

 Features Benefits
Package JEDEC-standard, compliant with the MMC specification Eases the design and validation process
Voltage 1.8V Vcc (1.8V I/O) Low voltage extends battery life in mobile devices
1.8V Vcc (1.8V I/O)
Densities 4GB–32GB Wide density range
Speed High speed: up to 52 MB/s Provides higher system performance
Temperature Ranges 25°C to +85°C Ideal for rugged environments
-40C to +85C
Internal Error Correction ECC Takes the burden off host controller and increases speed

Simplifying High-Capacity Storage for Mobile and Embedded Systems
Our e·MMC embedded memory simplifies high-capacity storage issues and eases the load that many wireless processors carry in mobile designs. It also capitalizes on MLC strengths, improving overall system-level performance. Find out how in our e·MMC white paper.
Download the white paper

Choosing the Right NAND
Understanding the advantages that each of the various NAND Flash memory types offers is important if you’re going to find the best possible solution for your application. To help, we’ve developed a Choosing the Right NAND guide, which offers a basic overview of the various NAND Flash options, enumerating the features and benefits of each.
View the guide

Type Secure Title & Description ID# Updated Size
IBIS Behavioral Models:  Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site. TN-00-07 11/2009 163.98 KB
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Recommended Soldering Parameters:  Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 03/2007 69.09 KB
Uprating of Semiconductors for High-Temperature Applications:  Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 428.33 KB
Understanding Signal Integrity:  Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 1.52 MB
PCN/EOL Systems:  Explains Micron's product change notification and end-of-life systems. CSN-12 08/2009 75.58 KB
Wafer Packaging and Packaging Materials:  Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 09/2011 776.24 KB
Bare Die SiPs and MCMs:  Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 151.06 KB
Shipping Quantities:  Provides tables of part quantity. CSN-04 10/2011 463.55 KB
Micron Component and Module Packaging:  Explanation of Micron packaging labels and procedures. CSN-16 02/2012 840.61 KB
ESD Precautions for Die/Wafer Handling and Assembly:  Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 119.08 KB
Electronic Data Interchange:  Describes EDI transmission sets, protocol, and contacts. CSN-06 09/2005 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices:  Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 82.64 KB
ISO System Management Standards:  Describes ISO system management standards. CSN-08 04/2004 39.18 KB
MCP Product Flyer:  4 reasons why Micron's MCPs are a perfect match 02/2009 248.97 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
Micron Wire-Bonding Techniques:  This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 66.13 KB
e·MMC Embedded Memory Flyer:  Discusses how e·MMC embedded memory works, the e·MMC 4.4 specification, features, benefits, and applications. 06/2009 157.56 KB
TN-10-21: Qualcomm QSC6695 Validation Report:  Rev. 1.0 12/2011 336.51 KB
TN-10-21: Qualcomm QSC6695 Register Settings:  Rev. 1.0 12/2011 482.14 KB
PoP User Guide:  Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process. CSN-34 08/2011 846.18 KB
Micron BGA Manufacturer's User Guide:  Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 07/2011 353.32 KB
Product Marks/Product and Packaging Labels:  Explains product part marking, and product and packaging labels. CSN-11 02/2012 666.83 KB
Bypass Capacitor Selection for High-Speed Designs:  Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 481.9 KB
e·MMC Linux Enablement:  This technical note describes supported and unsupported e·MMC features and how to enable them in Linux. It includes a discussion of the e·MMC standard (4.41) introduced in March 2010. TN-52-05 06/2011 297.87 KB

Please Note: To view Secure Documents (Secure Lock) please log in or click on a secured document to request access.

Does Micron eMMC support SPI mode?
Unfortunately, Micron eMMC does not support SPI mode. The JEDEC eMMC standard specification removed this functionality from the v4.3 specification.
Is v4.4 eMMC function backward compatible to v4.2 function?
Yes, v4.4 function is backward compatible to v4.2 function. The v4.2 MMC host can use the v4.4 eMMC device with v4.2 functionality. The v4.4 device has several additional features which are suitable for secure boot applications from eMMC devices.
We have an MMC host controller which supports v4.1 or earlier. Can we use a v4.2 eMMC device?
Yes, if the device density is up to 2GB. However, for 4GB and higher densities, you need to have the v4.2 MMC driver software in your system, because the device uses sector address mode which is defined in the v4.2 specification.
We have an SD/MMC card socket but don’t have a BGA socket to evaluate an eMMC device. Can we evaluate a Micron eMMC device?
Yes, Micron can provide a small board with a mounted BGA device that can fit into an SD/MMC standard card socket for use in evaluation.
What is the purpose of ROD resister? Why do we need to prepare ROD and RCMD on command line?
ROD resister is only used during the card identification period to support 400 kHz clock operation. During this period, the device uses an open drain driver which does not have pull-up capability. The host needs to have strong pull-up capability to operate the command line at 400 kHz. This must be disconnected after the card identification period. RCMD is used to keep the command line high when there is no transaction on the command line. If the host does not have ROD, the RCMD can be used instead. However, the maximum operating frequency during the card identification mode must be reduced.

e-MMC

Related Information

MCP