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Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
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TN-00-08
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05/2010
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252.18 KB
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Technical Note
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Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
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02/2010
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87.26 KB
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Technical Note
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Thermal Design Considerations of the Micron V100 WQVGA Engine:
Provides system design engineers with the thermal basics of the V100 engine, including describing methods for dissipating heat and calculating heat dissipation.
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TN-07-07
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05/2011
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138.21 KB
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Technical Note
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Video Data Processing in the Micron V100 WQVGA Engine:
Describes the video data processing so customers can experiment with font size and color to find the desired level of performance.
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TN-07-08
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05/2011
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92.15 KB
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Technical Note
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TN-07-16: Preventing Image Sticking in Microdisplays:
This technical note explains the underlying cause for image sticking—a phenomenon that occurs during projection when an outline of a previously displayed image remains visible after being displayed for a long period of time—and provides best practices for preventing it.
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TN-07-16
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05/2012
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402.45 KB
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Technical Note
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