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DRAM Process

As the leading DRAM manufacturer in South East Asia, we build our products on 300mm wafers using state-of-the-art advanced technology from Micron. TECH's memory devices, equipment and manufacturing techniques have been through several generations of upgrades, allowing us to maintain our competitive advantage on the world stage. Our passion for innovation and superior technology will continue to see us through into the future.

Here is the outline of the DRAM fabrication process. Place your pointer over each process step to find out more.

       
       

Cleanup

 

Oxidation/Diffusion

 

Low Pressure Chemical Vapour Deposition
       
Ion Implantation

 

Etching

 

Photolithography
       
Physical/Chemical
Vapour Deposition

 

Chemical Mechanical Polishing

 

Defect Analysis

       
Packaging & Shipping

 

Parametric & Multiprobe

 

Cleanup
Wafers are cleaned in liquid baths and previous steps are repeated in multiple cycles before it is ready for parametric and multiprobe testing.
           

Our finished products are then assembled, tested and packaged by Micron, and then marketed and sold by Micron under their brand name.

 

Superior products demand superior manufacturing facilities.

 
Bringing the wonder of submicron semiconductor technology to life!

 
Fueled by the world's demand for faster, better and more cost-effective DRAMs.

 

 

 

 

 

 

 

 

 


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