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Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
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TN-00-08
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05/2010
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252.18 KB
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Technical Note
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Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
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TN-00-15
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03/2007
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69.09 KB
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Technical Note
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Uprating of Semiconductors for High-Temperature Applications:
Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
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TN-00-18
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05/2010
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428.33 KB
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Technical Note
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Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
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TN-00-20
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12/2009
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1.52 MB
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Technical Note
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Memory Module Serial Presence-Detect:
Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules
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TN-04-42
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12/2009
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505.83 KB
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Technical Note
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Comparing Module Parameters:
Compares module parameters.
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TN-04-49
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03/2003
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52.71 KB
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Technical Note
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High-Speed DRAM Controller Design:
Identifies and discusses five key areas of DRAM controller design
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TN-04-54
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04/2008
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1 MB
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Technical Note
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DRAM Module Form Factors:
Compares the most common DRAM module form factors
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TN-04-55
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09/2009
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435.56 KB
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Technical Note
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Module Pinout Decoder:
Provides sorted pin assignment tables and pin location figures for use in DDR2 DIMM signal identification, tracing, and troubleshooting
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TN-47-03
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12/2004
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215.46 KB
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Technical Note
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Design Guide for Two DDR3-1066 UDIMM Systems:
Rev. B, Design guide to assist board designers implementing products using UDIMM systems
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TN-41-08
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01/2010
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1.1 MB
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Technical Note
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Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
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02/2010
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87.26 KB
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Technical Note
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Accelerate Design Cycles with Simulation Models:
Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
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TN-00-09
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02/2010
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206.91 KB
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Technical Note
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Micron Wire-Bonding Techniques:
This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
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TN-00-22
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11/2010
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66.13 KB
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Technical Note
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Bypass Capacitor Selection for High-Speed Designs:
Describes bypass capacitor selection for high-speed designs.
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TN-00-06
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03/2011
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481.9 KB
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Technical Note
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